ChrixXenon wrote:But reaper's LDO is also in a tiny package as far as I can see from the datasheet. How does anyone without industrial micro-manipulation machinery use these things?
You should be able to solder the TPS61200 using a hot air gun: https://www.youtube.com/watch?v=hYllE1gnzzU
Since the footprint of the center ground pad protudes from the chip (see recomended footprint in the datasheet), you might even be able to solder it without hot air. Of course using solder paste and a converted pizza oven or pan filled with some sand to reflow the board will make your life easier.
The TPS73633 also comes in SOT223 and SOT23-5 which can both be hand soldered with a fine tip soldering iron.